HU2139

Description: Thixotropic Paste Adhesive

Details: Is a two component, room temperature curing, thixotropic paste adhesive of high strength with good environmental and excellent chemical resistance. Used for bonding of metals, electronic components, GRP structures and many other items where a higher than normal temperature or more aggressive environment is to be encountered in service. The low out gassing makes this product suitable for specialist electronic telecommunication and aerospace applications.

Status: In-stock