TRA-BOND BA 2156

Description: Conductive Epoxy Adhesive

Details: Is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive components to printed circuit boards. This two-part adhesive develops strong, durable, high- impact bonds at room temperature that improve heat transfer while maintaining electrical insulation.

Status: In-stock